Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is ...

A defect in a semiconductor chip may be smaller than a human hair but can create big problems in your everyday life, from crippling your car's steering to making your laptop more susceptible to ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

MILPITAS, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system.

In recent years, significant advancements in ML have influenced several fields beyond computer science, including autonomous driving, structural color design, medicine, and face recognition. The ...

KLA Instruments™, a division of KLA Corporation, has expanded its defect inspection and metrology portfolio in 2023 to include new systems for semiconductor process development and control, including ...

This article is the second in a series from PDF Solutions on why adopting big data platforms will transform the compound semiconductor industry. The first part “Accelerating silicon carbide (SiC) ...

Continue reading to explore the role of automation in semiconductor manufacturing, as well as its challenges, advantages, and future directions. Like in many industries, automation came in ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...