FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

On the morning of January 28th, FPT announced the establishment of a semiconductor chip testing and packaging factory in ...

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D Semiconductor Packaging Market 3D Semiconductor Packaging Market Dublin, Jan. 27, ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

The establishment of the advanced semiconductor chip testing and packaging factory demonstrates FPT’s commitment to ...

FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant.